Invention Grant
- Patent Title: Multi-tier three-dimensional memory device with dielectric support pillars and methods for making the same
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Application No.: US17012862Application Date: 2020-09-04
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Publication No.: US11495616B2Publication Date: 2022-11-08
- Inventor: Takuya Sakurai , Yoshitaka Otsu
- Applicant: SANDISK TECHNOLOGIES LLC
- Applicant Address: US TX Addison
- Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee: SANDISK TECHNOLOGIES LLC
- Current Assignee Address: US TX Addison
- Agency: The Marbury Law Group PLLC
- Main IPC: H01L27/11582
- IPC: H01L27/11582 ; H01L27/11565 ; H01L27/1157 ; H01L27/11573 ; H01L23/522 ; H01L21/311 ; H01L21/28 ; H01L21/768 ; H01L27/11556 ; H01L27/11519 ; H01L27/11524 ; H01L27/11526
Abstract:
A semiconductor device includes an alternating stack of insulating layers and electrically conductive layers located over a substrate including a semiconductor material layer, a memory opening and a support opening extending through the alternating stack, a memory opening fill structure located in the memory opening and including a memory film and a semiconductor material portion in contact with the semiconductor material layer, and a support pillar structure located in the support opening. The support pillar structure lacks a semiconductor material portion which is in contact with the semiconductor material layer.
Public/Granted literature
- US3202044A Picture projecting system with remote portable control Public/Granted day:1965-08-24
Information query
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