Invention Grant
- Patent Title: Forming epitaxial structures in fin field effect transistors
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Application No.: US16725802Application Date: 2019-12-23
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Publication No.: US11495674B2Publication Date: 2022-11-08
- Inventor: Chia-Ling Chan , Derek Chen , Liang-Yin Chen , Chien-I Kuo
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/08 ; H01L29/167 ; H01L21/02 ; H01L21/225 ; H01L21/324

Abstract:
A method of forming source/drain features in a FinFET device includes providing a fin formed over a substrate and a gate structure formed over a fin, forming a recess in the fin adjacent to the gate structure, forming a first epitaxial layer in the recess, forming a second epitaxial layer over the first epitaxial layer, and forming a third epitaxial layer over the second epitaxial layer. The second epitaxial layer may be doped with a first element, while one or both of the first and the third epitaxial layer includes a second element different from the first element. One or both of the first and the third epitaxial layer may be formed by a plasma deposition process.
Information query
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