Invention Grant
- Patent Title: Method of forming semiconductor device package
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Application No.: US16884046Application Date: 2020-05-27
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Publication No.: US11508710B2Publication Date: 2022-11-22
- Inventor: Po-Yao Lin , Cheng-Yi Hong , Feng-Cheng Hsu , Shuo-Mao Chen , Shin-Puu Jeng , Shu-Shen Yeh , Kuang-Chun Lee
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L25/18
- IPC: H01L25/18 ; H01L23/538 ; H01L21/48 ; H01L21/56 ; H01L23/24 ; H01L25/00 ; H01L23/31 ; H01L21/683 ; H01L23/00 ; H01L23/373
Abstract:
A method of forming a semiconductor device package includes the following steps. A redistribution structure is formed on a carrier. A plurality of second semiconductor devices are disposed on the redistribution structure. At least one warpage adjusting component is disposed on at least one of the second semiconductor devices. A first semiconductor device is disposed on the redistribution structure. An encapsulating material is formed on the redistribution structure to encapsulate the first semiconductor device, the second semiconductor devices and the warpage adjusting component. The carrier is removed to reveal a bottom surface of the redistribution structure. A plurality of electrical terminals are formed on the bottom surface of the redistribution structure.
Public/Granted literature
- US20200286878A1 METHOD OF FORMING SEMICONDCUTOR DEVICE PACKAGE Public/Granted day:2020-09-10
Information query
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