Invention Grant
- Patent Title: Apparatus for distributing load and system for treating substrate with the apparatus
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Application No.: US17237175Application Date: 2021-04-22
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Publication No.: US11518169B2Publication Date: 2022-12-06
- Inventor: In Seok Ha , Jin Hyuck Yang , Jae Young Jang
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Chungcheongnam-do
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Chungcheongnam-do
- Agency: RatnerPrestia
- Priority: KR10-2020-0049568 20200423
- Main IPC: B41J2/145
- IPC: B41J2/145

Abstract:
Provided are a load distribution apparatus capable of efficiently distributing loads for a plurality of inkjet head modules and a substrate treatment system including the same. The load distribution apparatus includes a second support formed to be elongated in one direction and having both side portions higher than a central portion and in which a head module for discharging droplets onto a substrate is installed in the central portion, a first support supporting the second support on at least one side and supporting the second support below the second support, a first support unit supporting the second support on at least one side and supporting the second support above the second support, and a plate installed above the first support unit and connected to the first support unit, wherein a load of the head module is distributed by the first support and the first support unit.
Public/Granted literature
- US20210331466A1 APPARATUS FOR DISTRIBUTING LOAD AND SYSTEM FOR TREATING SUBSTRATE WITH THE APPARATUS Public/Granted day:2021-10-28
Information query
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