Invention Grant
- Patent Title: Semiconductor device package with conductive pillars and reinforcing and encapsulating layers
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Application No.: US16675011Application Date: 2019-11-05
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Publication No.: US11521958B2Publication Date: 2022-12-06
- Inventor: Ya Fang Chan , Yuan-Feng Chiang
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L25/00 ; H01L21/768 ; H01L23/00 ; H01L23/31 ; H01L27/108 ; H01L29/66 ; H01L21/285 ; H01L21/311 ; H01L21/3213 ; H01L23/528 ; H01L29/51 ; H01L21/3115 ; H01L21/265 ; H01L21/28 ; H01L21/02 ; H01L21/3065 ; H01L23/498 ; H01L21/762 ; H01L21/56 ; H01L21/48
Abstract:
A semiconductor device package includes a redistribution layer, a plurality of conductive pillars, a reinforcing layer and an encapsulant. The conductive pillars are in direct contact with the first redistribution layer. The reinforcing layer surrounds a lateral surface of the conductive pillars. The encapsulant encapsulates the first redistribution layer and the reinforcing layer. The conductive pillars are separated from each other by the reinforcing layer.
Public/Granted literature
- US20210134781A1 SEMICONDUCTOR DEVICE PACKAGE Public/Granted day:2021-05-06
Information query
IPC分类:
