Invention Grant
- Patent Title: High electron mobility transistor (HEMT) device and method of forming same
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Application No.: US17225482Application Date: 2021-04-08
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Publication No.: US11522067B2Publication Date: 2022-12-06
- Inventor: Chia-Ling Yeh , Ching Yu Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/20 ; H01L29/205 ; H01L21/768 ; H01L23/31 ; H01L21/02 ; H01L29/778

Abstract:
A high electron mobility transistor (HEMT) device and a method of forming the same are provided. The method includes forming a first III-V compound layer over a substrate. A second III-V compound layer is formed over the first III-V compound layer. The second III-V compound layer has a greater band gap than the first III-V compound layer. A third III-V compound layer is formed over the second III-V compound layer. The third III-V compound layer and the first III-V compound layer comprise a same III-V compound. A passivation layer is formed along a topmost surface and sidewalls of the third III-V compound layer. A fourth III-V compound layer is formed over the second III-V compound layer. The fourth III-V compound layer has a greater band gap than the first III-V compound layer.
Public/Granted literature
- US20210226040A1 HIGH ELECTRON MOBILITY TRANSISTOR (HEMT) DEVICE AND METHOD OF FORMING SAME Public/Granted day:2021-07-22
Information query
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