Invention Grant
- Patent Title: Vertical integration scheme and circuit elements architecture for area scaling of semiconductor devices
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Application No.: US17080458Application Date: 2020-10-26
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Publication No.: US11522072B2Publication Date: 2022-12-06
- Inventor: Rishabh Mehandru , Patrick Morrow , Ranjith Kumar , Cory E. Weber , Seiyon Kim , Stephen M. Cea , Tahir Ghani
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L29/45
- IPC: H01L29/45 ; H01L29/16 ; H01L29/66 ; H01L29/78 ; H01L21/822 ; H01L21/8238 ; H01L27/06 ; H01L27/11 ; H01L21/8234 ; H01L21/84 ; H01L27/108 ; H01L27/12 ; H01L29/778

Abstract:
Vertical integration schemes and circuit elements architectures for area scaling of semiconductor devices are described. In an example, an inverter structure includes a semiconductor fin separated vertically into an upper region and a lower region. A first plurality of gate structures is included for controlling the upper region of the semiconductor fin. A second plurality of gate structures is included for controlling the lower region of the semiconductor fin. The second plurality of gate structures has a conductivity type opposite the conductivity type of the first plurality of gate structures.
Public/Granted literature
- US20210043755A1 VERTICAL INTEGRATION SCHEME AND CIRCUIT ELEMENTS ARCHITECTURE FOR AREA SCALING OF SEMICONDUCTOR DEVICES Public/Granted day:2021-02-11
Information query
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