Invention Grant
- Patent Title: Dielectric composition, dielectric thin film, dielectric element, and electronic circuit board
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Application No.: US17190045Application Date: 2021-03-02
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Publication No.: US11524897B2Publication Date: 2022-12-13
- Inventor: Toshio Asahi , Masamitsu Haemori , Masahito Furukawa , Hitoshi Saita
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2020-039725 20200309
- Main IPC: H05K1/03
- IPC: H05K1/03 ; C01B21/082 ; H01G4/005
Abstract:
To provide a dielectric composition having excellent reliability. The dielectric composition contains a main component represented by a composition formula (Sr1-xCax)m(Ti1-yHfy)O3-δNδ, in which 0.15
Public/Granted literature
- US20210276868A1 DIELECTRIC COMPOSITION, DIELECTRIC THIN FILM, DIELECTRIC ELEMENT, AND ELECTRONIC CIRCUIT BOARD Public/Granted day:2021-09-09
Information query
