Invention Grant
- Patent Title: Setting method for substrate processing apparatus
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Application No.: US17501569Application Date: 2021-10-14
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Publication No.: US11527423B2Publication Date: 2022-12-13
- Inventor: Tae Hyun Park , Jae Young Jang , Kook Bong Lee
- Applicant: SEMES CO., LTD.
- Applicant Address: KR Chungcheongnam-do
- Assignee: SEMES CO., LTD.
- Current Assignee: SEMES CO., LTD.
- Current Assignee Address: KR Chungcheongnam-do
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- Priority: KR10-2020-0133206 20201015
- Main IPC: B41J2/045
- IPC: B41J2/045 ; H01L21/67 ; B41J11/46 ; B41J11/00

Abstract:
A method for setting a substrate processing apparatus having a head for dispensing ink includes aligning a position of at least one vision unit, by moving the vision unit above a reference mark and taking, by the vision unit, an image of the reference mark, in which the vision unit takes an image of a substrate, and the reference mark is made on the substrate processing apparatus and fixed in one position, and aligning at least one of a movement axis of the vision unit, a position of the substrate, or a movement axis of the substrate, by moving the vision unit or the substrate in a state in which the substrate having alignment marks made thereon is located under the vision unit and taking, by the vision unit, an image of the alignment marks.
Public/Granted literature
- US20220122854A1 SETTING METHOD FOR SUBSTRATE PROCESSING APPARATUS Public/Granted day:2022-04-21
Information query
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