Invention Grant
- Patent Title: Dielectric filler material in conductive material that functions as fiducial for an electronic device
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Application No.: US17078897Application Date: 2020-10-23
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Publication No.: US11527484B2Publication Date: 2022-12-13
- Inventor: Jesse C. Jones , Gang Duan , Jason Gamba , Yosuke Kanaoka , Rahul N. Manepalli , Vishal Shajan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L21/762 ; H01L23/538

Abstract:
An electronic device includes a substrate, and the substrate may include one or more layers. The one or more layers may include a dielectric material and may include one or more electrical traces. The electronic device may include a layer of conductive material, and the layer of conductive material may define a void in the conductive material. The electronic device may include a fiducial mark, and the fiducial mark may include a filler material positioned in the void defined by the conductive material. The fiducial mark may be coupled to the layer of conductive material. The filler material may have a lower reflectivity in comparison to the conductive material, for instance to provide a contrast with the conductive material.
Public/Granted literature
- US20210043580A1 DIELECTRIC FILLER MATERIAL IN CONDUCTIVE MATERIAL THAT FUNCTIONS AS FIDUCIAL FOR AN ELECTRONIC DEVICE Public/Granted day:2021-02-11
Information query
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