Invention Grant
- Patent Title: Memory cell with temperature modulated read voltage
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Application No.: US17149985Application Date: 2021-01-15
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Publication No.: US11532357B2Publication Date: 2022-12-20
- Inventor: Chao-I Wu , Win-San Khwa
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Potashnik, LLC
- Main IPC: G11C11/00
- IPC: G11C11/00 ; G11C13/00

Abstract:
An integrated chip has an array of memory cells disposed over a semiconductor substrate and a driver circuit. The driver circuit provides the array with a read voltage that varies in relation to an approximate temperature of the memory array to ameliorate temperature dependencies in read currents. The driver circuit may vary the read voltage in an inverse relationship with temperature. The read voltage may be varied continuous or stepwise and the driver circuit may use a table lookup. Optionally, the driver circuit measures a current and modulates the read voltage until the current is within a target range. The memory cells may be multi-level phase change memory cells that include a plurality phase change element disposed between a bottom electrode and a top electrode. Modulating the read voltage to reduce temperature-dependent current variations is particularly useful for multi-level cells.
Public/Granted literature
- US20220230680A1 MEMORY CELL WITH TEMPERATURE MODULATED READ VOLTAGE Public/Granted day:2022-07-21
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