Invention Grant
- Patent Title: Substrate processing apparatus
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Application No.: US16872441Application Date: 2020-05-12
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Publication No.: US11532487B2Publication Date: 2022-12-20
- Inventor: Akihiro Kubo , Yasushi Takiguchi , Teruhiko Kodama , Yoshiki Okamoto , Hayato Hosaka
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JPJP2019-091560 20190514
- Main IPC: H01L21/461
- IPC: H01L21/461 ; H01L21/67 ; B24B37/04 ; H01L21/306
Abstract:
A substrate processing apparatus includes a polishing member having a polishing surface configured to perform a polishing of a main surface of a substrate; a first dressing member having a first dressing surface configured to perform a dressing of the polishing surface; a second dressing member having a second dressing surface configured to perform a dressing of the first dressing surface; a holding member configured to hold the polishing member and the second dressing member; and a driving unit configured to, by moving the holding member, switch a first state in which the first dressing surface and the polishing surface come into contact with each other to perform the dressing of the polishing surface and a second state in which the first dressing surface and the second dressing surface come into contact with each other to perform the dressing of the first dressing surface.
Information query
IPC分类:
