Invention Grant
- Patent Title: Substrate processing apparatus and substrate processing method
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Application No.: US16830371Application Date: 2020-03-26
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Publication No.: US11532492B2Publication Date: 2022-12-20
- Inventor: Katsuhiro Morikawa , Masami Akimoto
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JPJP2019-063371 20190328
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/67 ; H01L21/306 ; H01L21/687

Abstract:
A substrate processing apparatus includes a liquid processing module, including a carry-out/in port of a substrate, in which a first liquid processing device and a second liquid processing device provided at a position farther from the carry-out/in port than the first liquid processing device is are provided; and a transfer device configured to carry the substrate out from and into the liquid processing module. The first liquid processing device performs a first liquid processing on the substrate. The second liquid processing device performs a second liquid processing on the substrate before or after the first liquid processing. The transfer device includes a substrate holder configured to be moved back and forth in a first horizontal direction, and carries the non-processed substrate into the first liquid processing device through the carry-out/in port and carries the processed substrate out from the first liquid processing device through the carry-out/in port.
Public/Granted literature
- US20200312678A1 SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD Public/Granted day:2020-10-01
Information query
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