公开(公告)号：US20230042744A1

公开(公告)日：2023-02-09

申请号：US17760120

申请日：2021-02-01

Applicant: Tokyo Electron Limited

Inventor： Masato Hamada ,  Masami Akimoto ,  Masatoshi Shiraishi ,  Satoshi Kaneko ,  Kazuki Motomatsu ,  Kazuyuki Goto

IPC: C25D17/06

Abstract: A plating method includes holding a substrate, supplying a plating liquid L1, supplying a conductive liquid L2 and applying a voltage. In the holding of the substrate, the substrate is held. In the supplying of the plating liquid L1, the plating liquid L1 is supplied onto the held substrate. In the supplying of the conductive liquid L2, the conductive liquid L2, which is different from the plating liquid L1 supplied on the substrate, is supplied onto the plating liquid L1. In the applying of the voltage, the voltage is applied between the substrate and the conductive liquid L2.

公开(公告)号：US12276027B2

公开(公告)日：2025-04-15

申请号：US17598597

申请日：2020-03-24

Applicant: Tokyo Electron Limited

Inventor： Katsuhiro Morikawa ,  Masami Akimoto ,  Mitsuaki Iwashita ,  Satoshi Kaneko

IPC: C23C18/16 ,  C23C18/18 ,  H01L21/02 ,  H01L21/288 ,  H01L21/67 ,  H01L21/677

Abstract: A substrate processing apparatus includes a liquid processing module, provided with a carry-out/in opening of a substrate, including therein a first liquid processing device and a second liquid processing device; a module-outside transfer device configured to carry the substrate out from and into the liquid processing module; and a module-inside transfer device configured to transfer the substrate between the first liquid processing device and the second liquid processing device. The first liquid processing device is equipped with a first holder configured to hold the substrate. The second liquid processing device is equipped with a second holder configured to hold the substrate. The second liquid processing device is configured to perform a plating processing on the substrate held by the second holder. The first liquid processing device is configured to perform at least a post-cleaning processing performed after the plating processing on the substrate held by the first holder.

公开(公告)号：US20230096305A1

公开(公告)日：2023-03-30

申请号：US17908660

申请日：2021-02-17

Applicant: Tokyo Electron Limited

Inventor： Masato Hamada ,  Masami Akimoto ,  Masatoshi Shiraishi ,  Kazuyuki Goto ,  Satoshi Kaneko ,  Kazuki Motomatsu

IPC: C25D5/08 ,  C25D17/10 ,  C25D21/08

Abstract: A plating apparatus 1 includes a substrate holder 10, a first electrode, a second electrode and a voltage applying unit 30. The substrate holder 10 is configured to hold a substrate. The first electrode is electrically connected to the substrate. The second electrode is configured to scan with respect to a front surface of the substrate. The voltage applying unit 30 is configured to apply a voltage between the first electrode and the second electrode. A first discharge opening 23 configured to discharge a plating liquid L1 and a second discharge opening 24 configured to discharge a cleaning liquid L2 are formed in a bottom surface 22a of the second electrode.

公开(公告)号：US20220399210A1

公开(公告)日：2022-12-15

申请号：US17755446

申请日：2020-10-19

Applicant: Tokyo Electron Limited

Inventor： Tsunenaga Nakashima ,  Masami Akimoto

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/02 ,  B08B5/02 ,  B05B1/00

Abstract: A particle removed from a substrate is suppressed from adhering to the substrate again. A substrate cleaning apparatus includes a substrate holder configured to hold the substrate; a gas nozzle configured to jet a cleaning gas to the substrate on the substrate holder; and a nozzle cover provided to surround the gas nozzle. The cleaning gas is jetted to a decompression chamber of the nozzle cover from the gas nozzle, and a gas cluster configured to remove the particle on the substrate in the decompression chamber is generated. A gas for a gas curtain is jetted from an end portion of the nozzle cover toward the substrate, and the gas curtain is formed between the substrate and the end portion of the nozzle cover.

公开(公告)号：US20200312678A1

公开(公告)日：2020-10-01

申请号：US16830371

申请日：2020-03-26

Applicant: Tokyo Electron Limited

Inventor： Katsuhiro Morikawa ,  Masami Akimoto

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687 ,  H01L21/306

Abstract: A substrate processing apparatus includes a liquid processing module, including a carry-out/in port of a substrate, in which a first liquid processing device and a second liquid processing device provided at a position farther from the carry-out/in port than the first liquid processing device is are provided; and a transfer device configured to carry the substrate out from and into the liquid processing module. The first liquid processing device performs a first liquid processing on the substrate. The second liquid processing device performs a second liquid processing on the substrate before or after the first liquid processing. The transfer device includes a substrate holder configured to be moved back and forth in a first horizontal direction, and carries the non-processed substrate into the first liquid processing device through the carry-out/in port and carries the processed substrate out from the first liquid processing device through the carry-out/in port.

公开(公告)号：US11551945B2

公开(公告)日：2023-01-10

申请号：US16583550

申请日：2019-09-26

Applicant: Tokyo Electron Limited

Inventor： Katsuhiro Morikawa ,  Masami Akimoto ,  Satoshi Morita ,  Kouichi Mizunaga

IPC: H01L21/67 ,  H01L21/304 ,  B08B3/04 ,  H01L21/02

Abstract: A substrate processing apparatus includes a rotation driving device configured to rotate a rotary table holding a substrate; a processing liquid nozzle configured to supply a processing liquid onto a top surface of the substrate; an electric heater provided at a top plate and configured to heat the substrate through the top plate; an electronic component configured to perform a power feed to the electric heater and transmission/reception of a control signal for the electric heater; and a periphery cover body connected to a peripheral portion of the top plate to be rotated along with the top plate. An accommodation space in which the electronic component is accommodated is formed under the top plate. The accommodation space is surrounded by a surrounding structure including the top plate and the periphery cover body. A gap between the peripheral portion of the top plate and the periphery cover body is sealed.

公开(公告)号：US11532492B2

公开(公告)日：2022-12-20

申请号：US16830371

申请日：2020-03-26

Applicant: Tokyo Electron Limited

Inventor： Katsuhiro Morikawa ,  Masami Akimoto

IPC: H01L21/677 ,  H01L21/67 ,  H01L21/306 ,  H01L21/687

Abstract: A substrate processing apparatus includes a liquid processing module, including a carry-out/in port of a substrate, in which a first liquid processing device and a second liquid processing device provided at a position farther from the carry-out/in port than the first liquid processing device is are provided; and a transfer device configured to carry the substrate out from and into the liquid processing module. The first liquid processing device performs a first liquid processing on the substrate. The second liquid processing device performs a second liquid processing on the substrate before or after the first liquid processing. The transfer device includes a substrate holder configured to be moved back and forth in a first horizontal direction, and carries the non-processed substrate into the first liquid processing device through the carry-out/in port and carries the processed substrate out from the first liquid processing device through the carry-out/in port.

公开(公告)号：US20220154342A1

公开(公告)日：2022-05-19

申请号：US17598597

申请日：2020-03-24

Applicant: Tokyo Electron Limited

Inventor： Katsuhiro Morikawa ,  Masami Akimoto ,  Mitsuaki Iwashita ,  Satoshi Kaneko

IPC: C23C18/16 ,  H01L21/288 ,  H01L21/02 ,  H01L21/67 ,  H01L21/677 ,  C23C18/18

Abstract: A substrate processing apparatus includes a liquid processing module, provided with a carry-out/in opening of a substrate, including therein a first liquid processing device and a second liquid processing device; a module-outside transfer device configured to carry the substrate out from and into the liquid processing module; and a module-inside transfer device configured to transfer the substrate between the first liquid processing device and the second liquid processing device. The first liquid processing device is equipped with a first holder configured to hold the substrate. The second liquid processing device is equipped with a second holder configured to hold the substrate. The second liquid processing device is configured to perform a plating processing on the substrate held by the second holder. The first liquid processing device is configured to perform at least a post-cleaning processing performed after the plating processing on the substrate held by the first holder.

公开(公告)号：US11208725B2

公开(公告)日：2021-12-28

申请号：US16583628

申请日：2019-09-26

Applicant: Tokyo Electron Limited

Inventor： Kouichi Mizunaga ,  Masami Akimoto ,  Satoshi Morita ,  Katsuhiro Morikawa

IPC: C23C18/16 ,  H01L21/683 ,  H01L21/67 ,  B05C13/02

Abstract: A substrate processing apparatus includes a rotary table comprising a base plate having a front surface where at least one suction hole is provided and an attraction plate having a front surface contacted with a non-processing surface of a substrate to attract the substrate, a rear surface contacted with the front surface of the base plate, and at least one through hole through which the front surface and the rear surface are connected; a rotation driving device configured to rotate the rotary table around a rotation axis; and a suction device configured to act a suction force on the suction hole, to contact the base plate with the attraction plate by acting the suction force between the base plate and the attraction plate, and to firmly contact the attraction plate with the substrate by acting the suction force between the attraction plate and the substrate through the through hole.

公开(公告)号：US09953852B2

公开(公告)日：2018-04-24

申请号：US14525541

申请日：2014-10-28

Applicant: TOKYO ELECTRON LIMITED

Inventor： Jiro Higashijima ,  Yuichi Douki ,  Masami Akimoto ,  Shigehisa Inoue

IPC: H01L21/67 ,  B08B1/04

CPC classification number: H01L21/6715 ,  B08B1/04 ,  H01L21/67051 ,  H01L21/6708 ,  Y10S134/902

Abstract: A liquid processing apparatus of the present disclosure performs a liquid processing by supplying a processing liquid to a substrate that is rotating. A substrate holding unit configured to be rotatable around a vertical axis is provided with a holding surface to attract and hold a bottom surface of the substrate horizontally. A guide unit is formed integrally with the substrate holding unit, disposed around the substrate held in the substrate holding unit, and provided at a position equal to or lower than a height of a top surface of a periphery of the substrate. The guide unit includes a guide surface configured to guide the processing liquid. A rotary cup rotates integrally with the substrate holding unit, and guides the processing liquid towards the cup between the rotary cup and the guide unit.