Invention Grant
- Patent Title: Forming metal contacts on metal gates
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Application No.: US17176020Application Date: 2021-02-15
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Publication No.: US11532717B2Publication Date: 2022-12-20
- Inventor: Chao-Hsun Wang , Yu-Feng Yin , Kuo-Yi Chao , Mei-Yun Wang , Feng-Yu Chang , Chen-Yuan Kao
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L27/085
- IPC: H01L27/085 ; H01L29/423 ; H01L29/45 ; H01L21/28 ; H01L29/49 ; H01L29/78 ; H01L29/66

Abstract:
A semiconductor structure includes a metal gate structure comprising a gate dielectric layer and a gate electrode, a conductive layer disposed over the metal gate structure, and a contact feature in direct contact with the top portion of the conductive layer, where the conductive layer includes a bottom portion disposed below a top surface of the metal gate structure and a top portion disposed over the top surface of the metal gate structure, and where the top portion laterally extends beyond a sidewall of the bottom portion.
Public/Granted literature
- US20210167179A1 FORMING METAL CONTACTS ON METAL GATES Public/Granted day:2021-06-03
Information query
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