Invention Grant
- Patent Title: Dielectric composition, dielectric thin film, dielectric element, and electronic circuit board
-
Application No.: US17034507Application Date: 2020-09-28
-
Publication No.: US11551867B2Publication Date: 2023-01-10
- Inventor: Masamitsu Haemori , Toshio Asahi , Hitoshi Saita
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Main IPC: H01G4/10
- IPC: H01G4/10 ; H01G4/33
Abstract:
The present invention provides a dielectric composition having high relative permittivity and insulation resistance at high temperature. The dielectric composition includes a main component expressed by a compositional formula (Sr1-x, Cax)m(Ti1-yHfy)O3-δNδ, in which 0
Public/Granted literature
- US20210110974A1 DIELECTRIC COMPOSITION, DIELECTRIC THIN FILM, DIELECTRIC ELEMENT, AND ELECTRONIC CIRCUIT BOARD Public/Granted day:2021-04-15
Information query
