- Patent Title: Integrated circuit devices and methods of manufacturing the same
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Application No.: US17329361Application Date: 2021-05-25
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Publication No.: US11552176B2Publication Date: 2023-01-10
- Inventor: Sanghyun Lee , Sungwoo Kang , Jongchul Park , Youngmook Oh , Jeongyun Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR10-2020-0062645 20200525
- Main IPC: H01L29/41
- IPC: H01L29/41 ; H01L29/417 ; H01L29/78 ; H01L29/08 ; H01L29/66 ; H01L21/285 ; H01L29/45

Abstract:
An integrated circuit device includes a fin-type active area that extends on a substrate in a first direction, a gate structure that extends on the substrate in a second direction and crosses the fin-type active area, source/drain areas arranged on first and second sides of the gate structure, and a contact structure electrically connected to the source/drain areas. The source/drain areas comprise a plurality of merged source/drain structures. Each source/drain area comprises a plurality of first points respectively located on an upper surface of the source/drain area at a center of each source/drain structure, and each source/drain area comprises at least one second point respectively located on the upper surface of the source/drain area where side surfaces of adjacent source/drain structures merge with one another. A bottom surface of the contact structure is non-uniform and corresponds to the first and second points.
Public/Granted literature
- US20210367049A1 INTEGRATED CIRCUIT DEVICES AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2021-11-25
Information query
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