Invention Grant
- Patent Title: Semiconductor chamber coatings and processes
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Application No.: US16891803Application Date: 2020-06-03
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Publication No.: US11557464B2Publication Date: 2023-01-17
- Inventor: Laksheswar Kalita , Son Nguyen , Dmitry Lubomirsky , Kenneth D. Schatz
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/3065 ; H01J37/32 ; C23C16/40

Abstract:
Systems and methods may be used to produce coated components. Exemplary semiconductor chamber components may include an aluminum alloy comprising nickel and may be characterized by a surface. The surface may include a corrosion resistant coating. The corrosion resistant coating may include a conformal layer and a non-metal layer. The conformal layer may extend about the semiconductor chamber component. The non-metal oxide layer may extend over a surface of the conformal layer. The non-metal oxide layer may be characterized by an amorphous microstructure having a hardness of from about 300 HV to about 10,000 HV. The non-metal oxide layer may also be characterized by an sp2 to sp3 hybridization ratio of from about 0.01 to about 0.5 and a hydrogen content of from about 1 wt. % to about 35 wt. %.
Information query
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