Invention Grant
- Patent Title: Nanosheet transistors with inner airgaps
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Application No.: US17132798Application Date: 2020-12-23
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Publication No.: US11557651B2Publication Date: 2023-01-17
- Inventor: Heng Wu , Ruilong Xie , Alexander Reznicek , Lan Yu
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Robert Sullivan
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/786 ; H01L29/66

Abstract:
A method is presented for constructing a nanosheet transistor. The method includes forming a nanosheet stack including alternating layers of a first material and a second material over a substrate, forming a dummy gate over the nanosheet stack, forming sacrificial spacers adjacent the dummy gate, and selectively etching the alternating layers of the first material to define gaps between the alternating layers of the second material. The method further includes filling the gaps with inner spacers, epitaxially growing source/drain regions adjacent the nanosheet stack, selectively removing the sacrificial spacers and the inner spacers to define cavities, and filling the cavities with a spacer material to define first airgaps adjacent the dummy gate and second airgaps adjacent the etched alternating layers of the first material.
Public/Granted literature
- US20210151556A1 NANOSHEET TRANSISTORS WITH INNER AIRGAPS Public/Granted day:2021-05-20
Information query
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