Invention Grant
- Patent Title: Power amplification module
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Application No.: US17211072Application Date: 2021-03-24
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Publication No.: US11569787B2Publication Date: 2023-01-31
- Inventor: Satoshi Arayashiki , Satoshi Goto , Satoshi Tanaka , Yasuhisa Yamamoto
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Main IPC: H03F3/21
- IPC: H03F3/21 ; H03F1/02 ; H03F3/193 ; H03F1/30

Abstract:
Provided is a power amplification module that includes: a first transistor, a first signal being inputted to a base thereof; a second transistor, the first signal being inputted to a base thereof and a collector thereof being connected to a collector of the first transistor; a first resistor, a first bias current being supplied to one end thereof and another end thereof being connected to the base of the first transistor; a second resistor, one end thereof being connected to the one end of the first resistor and another end thereof being connected to the base of the second transistor; and a third resistor, a second bias current being supplied to one end thereof and another end thereof being connected to the base of the second transistor.
Public/Granted literature
- US20210211106A1 POWER AMPLIFICATION MODULE Public/Granted day:2021-07-08
Information query
IPC分类: