Invention Grant
- Patent Title: Semiconductor package, and package on package having the same
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Application No.: US17024852Application Date: 2020-09-18
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Publication No.: US11581263B2Publication Date: 2023-02-14
- Inventor: Choongbin Yim , Jungwoo Kim , Jihwang Kim , Jungsoo Byun , Jongbo Shim , Doohwan Lee , Kyoungsei Choi , Junggon Choi , Sungeun Pyo
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR10-2020-0019995 20200218
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/538 ; H01L25/10

Abstract:
A semiconductor package includes: a redistribution layer including a plurality of redistribution insulating layers, a plurality of redistribution line patterns that constitute lower wiring layers, and a plurality of redistribution vias that are connected to some of the plurality of redistribution line patterns while penetrating at least one of the plurality of redistribution insulating layers; at least one semiconductor chip arranged on the redistribution layer; an expanded layer surrounding the at least one semiconductor chip on the redistribution layer; and a cover wiring layer including at least one base insulating layer, a plurality of wiring patterns that constitute upper wiring layers, and a plurality of conductive vias that are connected to some of the plurality of wiring patterns while penetrating the at least one base insulating layer.
Public/Granted literature
- US20210257305A1 SEMICONDUCTOR PACKAGE, AND PACKAGE ON PACKAGE HAVING THE SAME Public/Granted day:2021-08-19
Information query
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