Invention Grant
- Patent Title: Photosensitive composition for EUV light, pattern forming method, and method for manufacturing electronic device
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Application No.: US16655447Application Date: 2019-10-17
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Publication No.: US11604414B2Publication Date: 2023-03-14
- Inventor: Michihiro Shirakawa , Hajime Furutani , Mitsuhiro Fujita , Tomotaka Tsuchimura , Takashi Kawashima , Michihiro Ogawa , Akihiro Kaneko , Hironori Oka , Yasuharu Shiraishi
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JPJP2017-084466 20170421,JPJP2017-103304 20170525,JPJP2018-064289 20180329
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/004 ; G03F7/20

Abstract:
A photosensitive composition for EUV light includes a predetermined resin and a photoacid generator, or includes a predetermined resin having a repeating unit having a photoacid generating group, and satisfies Conditions 1 and 2, Condition 1: The A value determined by Formula (1) is 0.14 or more, A=([H]×0.04+[C]×1.0+[N]×2.1+[O]×3.6+[F]×5.6+[S]×1.5+[I]×39.5)/([H]×1+[C]×12+[N]×14+[O]×16+[F]×19+[S]×32+[I]×127) Formula (1): Condition 2: The concentration of the solid content in the photosensitive composition for EUV light is 2.5% by mass or less.
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