- 专利标题: Radome with integrated passive cooling
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申请号: US17133518申请日: 2020-12-23
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公开(公告)号: US11605886B1公开(公告)日: 2023-03-14
- 发明人: Gamal Refai-Ahmed , Chi-Yi Chao , Lik Tsang , Jens Weis , Brendan Farley , Anthony Torza , Suresh Ramalingam
- 申请人: XILINX, INC.
- 申请人地址: US CA San Jose
- 专利权人: XILINX, INC.
- 当前专利权人: XILINX, INC.
- 当前专利权人地址: US CA San Jose
- 代理机构: Patterson + Sheridan, LLP
- 主分类号: H01Q1/42
- IPC分类号: H01Q1/42 ; H01L23/427 ; H01Q1/02
摘要:
An antenna assembly is provided having passive cooling elements that enable compact design. In one example, an antenna assembly is provided that includes a heat sink assembly having an interior side and an exterior side, an antenna array, an antenna circuit board, and a radome. The antenna circuit board includes at least one integrated circuit (IC) die. The IC die has a conductive primary heat dissipation path to the interior side of the heat sink assembly. The radome is coupled to the heat sink assembly and encloses the antenna circuit board and the antenna array between the radome and the heat sink assembly. The heat sink assembly includes a metal base plate and at least a first heat pipe embedded with the metal base plate. The first heat pipe is disposed between the metal base plate and the IC die.