发明授权
- 专利标题: Method for forming channels in printed circuit boards by stacking slotted layers
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申请号: US16678188申请日: 2019-11-08
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公开(公告)号: US11606865B2公开(公告)日: 2023-03-14
- 发明人: Mikhail Pevzner , Gregory G. Beninati , James E. Benedict , Andrew R. Southworth
- 申请人: RAYTHEON COMPANY
- 申请人地址: US MA Waltham
- 专利权人: RAYTHEON COMPANY
- 当前专利权人: RAYTHEON COMPANY
- 当前专利权人地址: US MA Waltham
- 代理机构: Lando & Anastasi, LLP
- 主分类号: H05K3/46
- IPC分类号: H05K3/46
摘要:
A process of fabricating an electromagnetic circuit includes providing three laminate sheets, forming a first feature in a first laminate sheet of the three laminate sheets, and forming a second feature in a second laminate sheet of the three laminate sheets. The second feature is aligned with the first feature when aligning the second laminate sheet with the first laminate sheet. The process further includes stacking the three laminate sheets so that the first laminate sheet is positioned above and aligned with the second laminate sheet and the second laminate sheet is positioned above and aligned with the third laminate sheet. The first feature and the second feature define a contiguous element. The process further includes filling the contiguous element with an electrically conductive material to form an electrically continuous conductor.
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