公开(公告)号：US11375609B2

公开(公告)日：2022-06-28

申请号：US17091585

申请日：2020-11-06

Applicant: RAYTHEON COMPANY

Inventor： Thomas V. Sikina ,  James E. Benedict ,  John P. Haven ,  Andrew R. Southworth ,  Semira M. Azadzoi

IPC: H05K3/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/04 ,  H05K3/36 ,  H05K3/40 ,  H01P3/08 ,  H05K3/46

Abstract: A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.

公开(公告)号：US11122692B1

公开(公告)日：2021-09-14

申请号：US16898930

申请日：2020-06-11

Applicant: RAYTHEON COMPANY

Inventor： James E. Benedict ,  Gregory G. Beninati ,  Mikhail Pevzner ,  Thomas V. Sikina ,  Andrew R. Southworth

IPC: H05K3/34 ,  H05K3/00

Abstract: A process of fabricating a circuit includes providing a first sheet of dielectric material including a first top surface having at least one first conductive trace and a second sheet of dielectric material including a second top surface having at least one second conductive trace, depositing a first solder bump on the at least one first conductive trace, applying the second sheet of dielectric material to the first sheet of dielectric material with bonding film sandwiched in between, bonding the first and second sheets of dielectric material to one another, and providing a conductive material to connect the first solder bump on the at least one first conductive trace to the at least one second conductive trace.

公开(公告)号：US10813210B2

公开(公告)日：2020-10-20

申请号：US16184571

申请日：2018-11-08

Applicant: RAYTHEON COMPANY

Inventor： Semira M. Azadzoi ,  James E. Benedict ,  John P. Haven ,  Thomas V. Sikina ,  Andrew R. Southworth

IPC: H05K1/02 ,  H01P3/08 ,  H01P11/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/10 ,  H05K3/40 ,  H05K3/46

Abstract: A radio frequency circuit includes at least one dielectric substrate, a trench formed in the dielectric substrate, and an electrically continuous conductive material in the trench. The radio frequency circuit further may include a first dielectric substrate, a second dielectric substrate, with the trench being formed in the first and second dielectric substrates. A method of fabricating an electromagnetic circuit includes providing at least one dielectric substrate, machining a trench in the at least one dielectric substrate, and filling the trench with an electrically conductive material to form an electrically continuous conductor.

公开(公告)号：US20190269021A1

公开(公告)日：2019-08-29

申请号：US16287260

申请日：2019-02-27

Applicant: RAYTHEON COMPANY

Inventor： Jonathan E. Nufio-Molina ,  Thomas V. Sikina ,  James E. Benedict ,  Andrew R. Southworth ,  Semira M. Azadzoi

IPC: H05K3/46 ,  H05K1/02

Abstract: A method of manufacturing a power divider circuit includes milling a conductive material disposed upon a first substrate to form a signal trace. The signal trace includes a division from a single trace to two arm traces, with each of the two arm traces having a proximal end electrically connected to the single trace and a distal end electrically connected to each of two secondary traces. The method further includes depositing a resistive ink between the two distal ends to form a resistive electrical connection between the two arm traces, bonding a second substrate to the first substrate to substantially encapsulate the traces between the first substrate and the second substrate, and milling through at least one of the first substrate or the second substrate to provide access to at least one of the traces. A signal divider is further disclosed.

公开(公告)号：US20190150271A1

公开(公告)日：2019-05-16

申请号：US16184571

申请日：2018-11-08

Applicant: RAYTHEON COMPANY

Inventor： Semira M. Azadzoi ,  James E. Benedict ,  John P. Haven ,  Thomas V. Sikina ,  Andrew R. Southworth

IPC: H05K1/02 ,  H01P3/08 ,  H01P11/00 ,  H05K1/11 ,  H05K3/00 ,  H05K3/10 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/0218 ,  H01P3/08 ,  H01P11/003 ,  H05K1/0219 ,  H05K1/0221 ,  H05K1/0251 ,  H05K1/112 ,  H05K3/0044 ,  H05K3/107 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/4611 ,  H05K2201/0707 ,  H05K2201/09036 ,  H05K2201/09545 ,  H05K2203/0228

Abstract: A radio frequency circuit includes at least one dielectric substrate, a trench formed in the dielectric substrate, and an electrically continuous conductive material in the trench. The radio frequency circuit further may include a first dielectric substrate, a second dielectric substrate, with the trench being formed in the first and second dielectric substrates. A method of fabricating an electromagnetic circuit includes providing at least one dielectric substrate, machining a trench in the at least one dielectric substrate, and filling the trench with an electrically conductive material to form an electrically continuous conductor.

公开(公告)号：US11145977B2

公开(公告)日：2021-10-12

申请号：US16441837

申请日：2019-06-14

Applicant: RAYTHEON COMPANY

Inventor： Kevin Wilder ,  Jonathan E. Nufio-Molina ,  Phillip W. Thiessen ,  Thomas V. Sikina ,  James E. Benedict ,  Andrew R. Southworth ,  Erika Klek

IPC: H01Q1/12 ,  H01Q25/00 ,  H01Q21/00 ,  H01P1/04 ,  H01Q3/30 ,  H05K1/02

Abstract: An array includes a support structure configured to support columns of beamformer assemblies, and a plurality of beamformer assemblies supported by the support structure. Each beamformer assembly includes at least one beamformer having at least one first beamformer segment and at least one second beamformer segment configured to interconnect with the first beamformer segment.

公开(公告)号：US11145952B2

公开(公告)日：2021-10-12

申请号：US16683593

申请日：2019-11-14

Applicant: RAYTHEON COMPANY

Inventor： Thomas V. Sikina ,  John P. Haven ,  Kevin Wilder ,  James E. Benedict ,  Andrew R. Southworth ,  Mary K. Herndon

IPC: H01Q3/34 ,  H01Q1/24 ,  H01Q1/52 ,  H01Q21/00 ,  H01Q21/06

Abstract: A communications array includes a support structure configured to array elements, and a plurality of array elements supported by the support structure. Each array element is fabricated from an advanced manufacturing techniques (AMT) process. The support structure may be fabricated from a printed circuit board (PCB) or similar dielectric material. Each array element may include a radiator and/or a beamformer manufactured using the AMT process. The communications array further may include a copper vertical launch (CVL) and/or an electromagnetic boundary.

公开(公告)号：US11109489B2

公开(公告)日：2021-08-31

申请号：US16541789

申请日：2019-08-15

Applicant: RAYTHEON COMPANY

Inventor： Mikhail Pevzner ,  James E. Benedict ,  Andrew R. Southworth ,  Thomas V. Sikina ,  Kevin Wilder ,  Matthew Souza ,  Aaron Michael Torberg

IPC: H05K3/10 ,  B21F11/00

Abstract: An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.

公开(公告)号：US20210059043A1

公开(公告)日：2021-02-25

申请号：US17091585

申请日：2020-11-06

Applicant: RAYTHEON COMPANY

Inventor： Thomas V. Sikina ,  James E. Benedict ,  John P. Haven ,  Andrew R. Southworth ,  Semira M. Azadzoi

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/04 ,  H05K3/36 ,  H05K3/40 ,  H05K3/00 ,  H01P3/08 ,  H05K3/46

Abstract: A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.

公开(公告)号：US20190148828A1

公开(公告)日：2019-05-16

申请号：US16183116

申请日：2018-11-07

Applicant: RAYTHEON COMPANY

Inventor： Thomas V. Sikina ,  John P. Haven ,  James E. Benedict ,  Jonathan E. Nufio-Molina ,  Andrew R. Southworth

IPC: H01Q1/52 ,  H01Q1/44 ,  H01Q1/42 ,  H01Q21/00

Abstract: A low profile array (LPA) includes an antenna element array layer having at least one Faraday wall, and a beamformer circuit layer coupled to the antenna element array layer. The beamformer circuit layer has at least one Faraday wall. The Faraday walls extends between ground planes associated with at least one of the antenna element array layer and the beamformer circuit layer.