COMPONENT MANUFACTURE AND EXTERNAL INSPECTION

    公开(公告)号:US20220297248A1

    公开(公告)日:2022-09-22

    申请号:US17204556

    申请日:2021-03-17

    Abstract: A method of manufacture is provided that includes providing a preform component. The preform component includes a blind aperture in an exterior of the preform component. The exterior of the preform component is machined to provide a machined component. An exterior of the machined component is inspected to determine a characteristic of the machined component, which characteristic of the machined component is associated with the blind aperture. Whether a feature of the machined component satisfies a standard is determined based on the characteristic of the machined component.

    METHOD FOR FORMING CHANNELS IN PRINTED CIRCUIT BOARDS BY STACKING SLOTTED LAYERS

    公开(公告)号:US20210144864A1

    公开(公告)日:2021-05-13

    申请号:US16678188

    申请日:2019-11-08

    Abstract: A process of fabricating an electromagnetic circuit includes providing three laminate sheets, forming a first feature in a first laminate sheet of the three laminate sheets, and forming a second feature in a second laminate sheet of the three laminate sheets. The second feature is aligned with the first feature when aligning the second laminate sheet with the first laminate sheet. The process further includes stacking the three laminate sheets so that the first laminate sheet is positioned above and aligned with the second laminate sheet and the second laminate sheet is positioned above and aligned with the third laminate sheet. The first feature and the second feature define a contiguous element. The process further includes filling the contiguous element with an electrically conductive material to form an electrically continuous conductor.

    METHOD FOR FORMING CHANNELS IN PRINTED CIRCUIT BOARDS BY STACKING SLOTTED LAYERS

    公开(公告)号:US20230209728A1

    公开(公告)日:2023-06-29

    申请号:US18173390

    申请日:2023-02-23

    CPC classification number: H05K3/465 H05K3/4679

    Abstract: A process of fabricating an electromagnetic circuit includes providing three laminate sheets, forming a first feature in a first laminate sheet of the three laminate sheets, and forming a second feature in a second laminate sheet of the three laminate sheets. The second feature is aligned with the first feature when aligning the second laminate sheet with the first laminate sheet. The process further includes stacking the three laminate sheets so that the first laminate sheet is positioned above and aligned with the second laminate sheet and the second laminate sheet is positioned above and aligned with the third laminate sheet. The first feature and the second feature define a contiguous element. The process further includes filling the contiguous element with an electrically conductive material to form an electrically continuous conductor.

    Method for forming channels in printed circuit boards by stacking slotted layers

    公开(公告)号:US11606865B2

    公开(公告)日:2023-03-14

    申请号:US16678188

    申请日:2019-11-08

    Abstract: A process of fabricating an electromagnetic circuit includes providing three laminate sheets, forming a first feature in a first laminate sheet of the three laminate sheets, and forming a second feature in a second laminate sheet of the three laminate sheets. The second feature is aligned with the first feature when aligning the second laminate sheet with the first laminate sheet. The process further includes stacking the three laminate sheets so that the first laminate sheet is positioned above and aligned with the second laminate sheet and the second laminate sheet is positioned above and aligned with the third laminate sheet. The first feature and the second feature define a contiguous element. The process further includes filling the contiguous element with an electrically conductive material to form an electrically continuous conductor.

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