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公开(公告)号：US11145977B2
公开(公告)日：2021-10-12
申请号：US16441837
申请日：2019-06-14
申请人： RAYTHEON COMPANY
发明人： Kevin Wilder , Jonathan E. Nufio-Molina , Phillip W. Thiessen , Thomas V. Sikina , James E. Benedict , Andrew R. Southworth , Erika Klek
摘要： An array includes a support structure configured to support columns of beamformer assemblies, and a plurality of beamformer assemblies supported by the support structure. Each beamformer assembly includes at least one beamformer having at least one first beamformer segment and at least one second beamformer segment configured to interconnect with the first beamformer segment.
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公开(公告)号：US11145952B2
公开(公告)日：2021-10-12
申请号：US16683593
申请日：2019-11-14
申请人： RAYTHEON COMPANY
发明人： Thomas V. Sikina , John P. Haven , Kevin Wilder , James E. Benedict , Andrew R. Southworth , Mary K. Herndon
摘要： A communications array includes a support structure configured to array elements, and a plurality of array elements supported by the support structure. Each array element is fabricated from an advanced manufacturing techniques (AMT) process. The support structure may be fabricated from a printed circuit board (PCB) or similar dielectric material. Each array element may include a radiator and/or a beamformer manufactured using the AMT process. The communications array further may include a copper vertical launch (CVL) and/or an electromagnetic boundary.
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公开(公告)号：US11109489B2
公开(公告)日：2021-08-31
申请号：US16541789
申请日：2019-08-15
申请人： RAYTHEON COMPANY
发明人： Mikhail Pevzner , James E. Benedict , Andrew R. Southworth , Thomas V. Sikina , Kevin Wilder , Matthew Souza , Aaron Michael Torberg
摘要： An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.
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公开(公告)号：US10999938B1
公开(公告)日：2021-05-04
申请号：US16861326
申请日：2020-04-29
申请人： Raytheon Company
发明人： Mikhail Pevzner , Donald G. Hersey , Gregory G. Beninati , Thomas J. Tellinghuisen , James E. Benedict
摘要： Methods and apparatus for an assembly having first and second circuit cards mated together with a ball stack on the first circuit card extending into a through hole in the second circuit card. A wirebond connects the first ball stack to a bond pad on the first surface of the second circuit card forming a low profile connector-less interconnect. The ball stack comprises at least two balls stacked on top of each other and bonded to each other, wherein the balls are generated from wire.
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公开(公告)号：US20210059043A1
公开(公告)日：2021-02-25
申请号：US17091585
申请日：2020-11-06
申请人： RAYTHEON COMPANY
发明人： Thomas V. Sikina , James E. Benedict , John P. Haven , Andrew R. Southworth , Semira M. Azadzoi
摘要： A radio frequency connector includes a substrate, a first ground plane disposed upon the substrate, a signal conductor having a first contact point, with the first contact point being configured to electrically mate with a second contact point, and a first ground boundary configured to electrically mate with a second ground boundary, with the first ground boundary being formed as an electrically continuous conductor within the substrate.
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公开(公告)号：US20190315500A1
公开(公告)日：2019-10-17
申请号：US16385546
申请日：2019-04-16
申请人： Raytheon Company
发明人： Tuan L. Duong , Adam D. Leeds , James E. Benedict
摘要： A system includes a flight vehicle and one or more deployable radiators. Each deployable radiator includes a structure configured to receive thermal energy and to reject the thermal energy into an external environment. The structure includes (i) multiple inline and interconnected thermomechanical regions and (ii) one or more thermal energy transfer devices embedded in at least some of the thermomechanical regions. The one or more thermal energy transfer devices are configured to transfer the thermal energy between different ones of the thermomechanical regions. At least one of the thermomechanical regions includes one or more shape-memory materials configured to cause a shape of the structure to change. The thermomechanical regions may include one or more heat input regions configured to receive the thermal energy, one or more heat rejection regions configured to reject the thermal energy into the external environment, and one or more morphable regions including the one or more shape-memory materials and configured to change shape.
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公开(公告)号：US20190148837A1
公开(公告)日：2019-05-16
申请号：US16180936
申请日：2018-11-05
申请人： RAYTHEON COMPANY
摘要： Described herein is a low profile radiator (LPR) manufactured using additive manufacturing technology (AMT). Such an AMT radiator is suitable for use in an array antenna which may be fabricated using AMT manufacturing processes.
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公开(公告)号：US20190148828A1
公开(公告)日：2019-05-16
申请号：US16183116
申请日：2018-11-07
申请人： RAYTHEON COMPANY
发明人： Thomas V. Sikina , John P. Haven , James E. Benedict , Jonathan E. Nufio-Molina , Andrew R. Southworth
摘要： A low profile array (LPA) includes an antenna element array layer having at least one Faraday wall, and a beamformer circuit layer coupled to the antenna element array layer. The beamformer circuit layer has at least one Faraday wall. The Faraday walls extends between ground planes associated with at least one of the antenna element array layer and the beamformer circuit layer.
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公开(公告)号：US11569574B2
公开(公告)日：2023-01-31
申请号：US16418231
申请日：2019-05-21
申请人： RAYTHEON COMPANY
摘要： A wave phased array is manufactured using additive manufacturing technology (AMT). The wave phased array includes a radiator, a radiator dilation layer supporting the radiator, a beamformer supporting the radiator dilation layer, a beamformer dilation layer supporting the beamformer, and a substrate support layer supporting the beamformer dilation layer. At least one of the radiator, the radiator dilation layer, the beamformer, the beamformer dilation layer and the substrate support layer is fabricated at least in part by an AMT process.
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公开(公告)号：US11497118B2
公开(公告)日：2022-11-08
申请号：US17174904
申请日：2021-02-12
申请人： RAYTHEON COMPANY
摘要： A method of fabricating a printed circuit assembly includes providing a flexible-hybrid circuit having a base and at least one side panel. The at least one side panel is hingedly connected to the base. The method further includes disposing a support structure on the flexible-hybrid circuit. The support structure includes a base, which is disposed on the base of the flexible-hybrid circuit, and at least one side that corresponds to the at least one side panel of the flexible-hybrid circuit. The method further includes folding the at least one side panel of the flexible-hybrid circuit so that the at least one side panel is disposed co-planar with the at least one side of the support structure to create a printed circuit assembly.
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