Invention Grant
- Patent Title: Semiconductor manufacturing apparatus and method for transferring wafer
-
Application No.: US17177382Application Date: 2021-02-17
-
Publication No.: US11621185B2Publication Date: 2023-04-04
- Inventor: Rintaro Takao , Naohide Ito , Hiroaki Dewa , Masayuki Kozawa
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Venjuris, P.C.
- Priority: JPJP2020-045740 20200316
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/68 ; B65G49/07 ; H01L21/67 ; G05B19/418

Abstract:
A semiconductor manufacturing apparatus includes one or more process modules, a scheduler, and a transfer controller. A product wafer of a lot that is transferred from a load port to one of the one or more process modules is replenished such that a total number of wafers that are simultaneously processed in the one or more process modules becomes N. When an advance lot being processed and a post lot to be processed subsequent to the advance lot have a same processing condition, the scheduler creates the transfer plan to replenish with the product wafer of the post lot instead of a dummy wafer such that the transfer controller transfers the product wafer and the dummy wafer to the one or more process modules according to the created transfer plan.
Public/Granted literature
- US20210287920A1 SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD FOR TRANSFERRING WAFER Public/Granted day:2021-09-16
Information query
IPC分类: