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公开(公告)号:US09766617B2
公开(公告)日:2017-09-19
申请号:US14063341
申请日:2013-10-25
Applicant: TOKYO ELECTRON LIMITED
Inventor: Junichi Ogawa , Youichi Nakayama , Keiji Osada , Hiroaki Dewa
IPC: H01L21/67 , G05B19/418
CPC classification number: G05B19/41865 , G05B2219/45031 , H01L21/67276 , Y02P90/20 , Y02P90/86
Abstract: The substrate processing apparatus includes: a plurality of processing modules; a transfer mechanism; a controller; and a setting unit. The processing module processes with respect to the substrate. The transfer mechanism transfers the substrate ejected from the transfer container. The controller outputs control signals for transferring the substrate to the plurality of processing modules along a previously set transfer path through the transfer mechanism sequentially, and for processing with respect to the substrate in the processing module of a transfer destination based on a processing recipe in which a processing order and a processing condition are set. The setting unit sets a content of a non-recipe operation except for operations set in the processing recipe and a performing timing for performing the non-recipe operation by a control operation of the controller every processing module. The non-recipe operation is performed with respect to the processing modules.
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公开(公告)号:US11621185B2
公开(公告)日:2023-04-04
申请号:US17177382
申请日:2021-02-17
Applicant: Tokyo Electron Limited
Inventor: Rintaro Takao , Naohide Ito , Hiroaki Dewa , Masayuki Kozawa
IPC: H01L21/677 , H01L21/68 , B65G49/07 , H01L21/67 , G05B19/418
Abstract: A semiconductor manufacturing apparatus includes one or more process modules, a scheduler, and a transfer controller. A product wafer of a lot that is transferred from a load port to one of the one or more process modules is replenished such that a total number of wafers that are simultaneously processed in the one or more process modules becomes N. When an advance lot being processed and a post lot to be processed subsequent to the advance lot have a same processing condition, the scheduler creates the transfer plan to replenish with the product wafer of the post lot instead of a dummy wafer such that the transfer controller transfers the product wafer and the dummy wafer to the one or more process modules according to the created transfer plan.
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