- 专利标题: Microstructure enhanced absorption photosensitive devices
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申请号: US17707429申请日: 2022-03-29
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公开(公告)号: US11621360B2公开(公告)日: 2023-04-04
- 发明人: Shih-Yuan Wang , Shih-Ping Wang
- 申请人: W&WSENS DEVICES, INC.
- 申请人地址: US CA Los Altos
- 专利权人: W&WSENS DEVICES, INC.
- 当前专利权人: W&WSENS DEVICES, INC.
- 当前专利权人地址: US CA Los Altos
- 代理机构: Wissing Miller LLP
- 主分类号: H01L31/0352
- IPC分类号: H01L31/0352 ; H01L31/075 ; H01L31/105 ; H01L31/028 ; H01L31/0224 ; H01L31/107 ; H01L31/02 ; H01L31/0236 ; G02B6/136 ; H01L31/0312 ; H01L31/036 ; H01L31/077 ; H01L31/18 ; H01L31/054 ; G02B6/122 ; H01L23/66 ; H01L31/0232 ; H01L31/024 ; H01L31/0304 ; H01L31/0745 ; G02B6/12
摘要:
Techniques for enhancing the absorption of photons in semiconductors with the use of microstructures are described. The microstructures, such as pillars and/or holes, effectively increase the effective absorption length resulting in a greater absorption of the photons. Using microstructures for absorption enhancement for silicon photodiodes and silicon avalanche photodiodes can result in bandwidths in excess of 10 Gb/s at photons with wavelengths of 850 nm, and with quantum efficiencies of approximately 90% or more.
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