Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16810492Application Date: 2020-03-05
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Publication No.: US11631758B2Publication Date: 2023-04-18
- Inventor: Yasunari Umemoto , Isao Obu , Kaoru Ideno , Shigeki Koya
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JPJP2019-040690 20190306,JPJP2019-190441 20191017
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L29/06 ; H01L29/737

Abstract:
A semiconductor device includes a collector layer, a base layer, and an emitter layer that are disposed above a substrate. An emitter mesa layer is disposed on a partial region of the emitter layer. In a plan view, the base electrode is disposed in or on a region which does not overlap the emitter mesa layer. The base electrode allows base current to flow to the base layer. In the plan view, a first edge forming part of edges of the emitter mesa layer extends in a first direction, and a second edge forming part of edges of the base electrode faces the first edge. A gap between the first edge and the second edge in a terminal portion located in an end portion of the emitter mesa layer in the first direction is wider than a gap in an intermediate portion of the emitter mesa layer.
Public/Granted literature
- US20200287027A1 SEMICONDUCTOR DEVICE Public/Granted day:2020-09-10
Information query
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