Invention Grant
- Patent Title: Packaged white light emitting devices comprising photoluminescence layered structure
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Application No.: US17379272Application Date: 2021-07-19
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Publication No.: US11631792B2Publication Date: 2023-04-18
- Inventor: Jun-Gang Zhou , Gang Wang , Yi-Qun Li
- Applicant: Intematix Corporation
- Applicant Address: US CA Fremont
- Assignee: Intematix Corporation
- Current Assignee: Intematix Corporation
- Current Assignee Address: US CA Fremont
- Agency: CrossPond Law
- Main IPC: H01L33/50
- IPC: H01L33/50 ; C09K11/61 ; C09K11/66 ; H01L25/075 ; H01L33/60 ; C09K11/77

Abstract:
A light emitting device includes a Chip Scale Packaged (CSP) LED, the CSP LED including an LED chip that generates blue excitation light; and a photoluminescence layer that covers a light emitting face of the LED chip, wherein the photoluminescence layer comprises from 75 wt % to 100 wt % of a manganese-activated fluoride photoluminescence material of the total photoluminescence material content of the layer. The device/CSP LED can further include a further photoluminescence layer that covers the first photoluminescence and that includes a photoluminescence material that generates light with a peak emission wavelength from 500 nm to 650 nm.
Public/Granted literature
- US20210408342A1 Packaged White Light Emitting Devices Comprising Photoluminescence Layered Structure Public/Granted day:2021-12-30
Information query
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