Invention Grant
- Patent Title: Integrated circuit device with separate die for programmable fabric and programmable fabric support circuitry
-
Application No.: US15855419Application Date: 2017-12-27
-
Publication No.: US11632112B2Publication Date: 2023-04-18
- Inventor: Ravi Prakash Gutala , Aravind Raghavendra Dasu , Sean R. Atsatt , Scott J. Weber
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Fletcher Yoder P.C.
- Main IPC: G06F7/38
- IPC: G06F7/38 ; H03K19/173 ; H03K19/0175 ; G06F3/06 ; G11C11/417 ; H01L25/18 ; H01L27/02 ; H01L23/48 ; H01L23/538 ; H01L23/00 ; H01L25/00 ; H01L23/367 ; G11C7/10 ; H03K19/17796 ; G11C5/04 ; G06F30/34

Abstract:
An integrated circuit device having separate dies for programmable logic fabric and circuitry to operate the programmable logic fabric are provided. A first integrated circuit die may include field programmable gate array fabric. A second integrated circuit die may be coupled to the first integrated circuit die. The second integrated circuit die may include fabric support circuitry that operates the field programmable gate array fabric of the first integrated circuit die.
Public/Granted literature
Information query