Invention Grant
- Patent Title: Method and apparatus for use in wafer processing
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Application No.: US17219351Application Date: 2021-03-31
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Publication No.: US11637028B2Publication Date: 2023-04-25
- Inventor: Thomas Fischer , Gerald Lackner , Walter Horst Leitgeb , Michael Lecher
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/67
- IPC: H01L21/67 ; G01B11/27 ; H01L21/68 ; H01L21/78 ; H01L21/66

Abstract:
In an embodiment an apparatus includes a receptacle configured to receive a wafer, a light port configured to emit light from a source of light so as to shine the light on an edge of the wafer, wherein the light port is an opening located on a surface of the receptacle and a light sensitive element configured to receive light that passed the edge of the wafer and to form a detection signal based on the received light, wherein the light port is located underneath the wafer.
Public/Granted literature
- US20210217640A1 Method and Apparatus for Use in Wafer Processing Public/Granted day:2021-07-15
Information query
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