Invention Grant
- Patent Title: Using sacrificial material in additive manufacturing of polishing pads
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Application No.: US17137304Application Date: 2020-12-29
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Publication No.: US11642757B2Publication Date: 2023-05-09
- Inventor: Daniel Redfield , Jason Garcheung Fung , Mayu Felicia Yamamura
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- Main IPC: B24D11/00
- IPC: B24D11/00 ; B29C64/112 ; B29C64/393 ; B33Y30/00 ; B33Y80/00 ; B33Y50/02 ; B33Y10/00 ; B29C64/282 ; B29C64/40 ; C09G1/16 ; B24B37/20 ; B29L31/00

Abstract:
A method of fabricating a polishing pad using an additive manufacturing system includes depositing a first set successive layers by droplet ejection to form a. Depositing the successive layers includes dispensing a polishing pad precursor to first regions corresponding to partitions of the polishing pad and dispensing a sacrificial material to second regions corresponding to grooves of the polishing pad. Removing the sacrificial material provides the polishing pad with a polishing surface that has the partitions separated by the grooves.
Public/Granted literature
- US20210114172A1 USING SACRIFICIAL MATERIAL IN ADDITIVE MANUFACTURING OF POLISHING PADS Public/Granted day:2021-04-22
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