Invention Grant
- Patent Title: Automatic detection method and automatic detection system for detecting crack on wafer edges
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Application No.: US17100982Application Date: 2020-11-23
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Publication No.: US11644427B2Publication Date: 2023-05-09
- Inventor: Chia-Feng Hsiao , Chung-Hsuan Wu , Shuo-Yu Chen , Nai-Ying Lo , Yi-Hui Tseng , Chen-Hui Huang , Yung-Yu Yang , Tzu-Ping Kao
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsinchu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C.
- Priority: CN 2011144170.9 2020.10.23
- Main IPC: G06K9/00
- IPC: G06K9/00 ; G01N21/95 ; H01L21/66 ; G01N21/956 ; G06T7/00 ; G06T7/13 ; G06V10/30 ; G06V10/28 ; G06V10/26 ; G01N21/88 ; G06T5/50 ; G06V10/22
Abstract:
An automatic detection method and an automatic detection system for detecting any crack on wafer edges are provided. The automatic detection method includes the following steps. Several wafer images of several wafers are obtained. The wafer images are integrated to create a templet image. Each of the wafer images is compared with the templet image to obtain a differential image. Each of the differential images is binarized. Each of the differential images which are binarized is de-noised. Whether each of the differential images has an edge crack is detected according to pattern of each of the differential images which are de-noised.
Public/Granted literature
- US20220128485A1 AUTOMATIC DETECTION METHOD AND AUTOMATIC DETECTION SYSTEM FOR DETECTING CRACK ON WAFER EDGES Public/Granted day:2022-04-28
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