公开(公告)号：US11644427B2

公开(公告)日：2023-05-09

申请号：US17100982

申请日：2020-11-23

申请人： UNITED MICROELECTRONICS CORP.

发明人： Chia-Feng Hsiao ,  Chung-Hsuan Wu ,  Shuo-Yu Chen ,  Nai-Ying Lo ,  Yi-Hui Tseng ,  Chen-Hui Huang ,  Yung-Yu Yang ,  Tzu-Ping Kao

IPC分类号： G06K9/00 ,  G01N21/95 ,  H01L21/66 ,  G01N21/956 ,  G06T7/00 ,  G06T7/13 ,  G06V10/30 ,  G06V10/28 ,  G06V10/26 ,  G01N21/88 ,  G06T5/50 ,  G06V10/22

CPC分类号： G01N21/9503 ,  G01N21/8851 ,  G01N21/95607 ,  G06T5/50 ,  G06T7/001 ,  G06T7/0004 ,  G06T7/13 ,  G06V10/22 ,  G06V10/26 ,  G06V10/28 ,  G06V10/30 ,  H01L22/24 ,  G06T2207/20212 ,  G06T2207/20221 ,  G06T2207/30148

摘要： An automatic detection method and an automatic detection system for detecting any crack on wafer edges are provided. The automatic detection method includes the following steps. Several wafer images of several wafers are obtained. The wafer images are integrated to create a templet image. Each of the wafer images is compared with the templet image to obtain a differential image. Each of the differential images is binarized. Each of the differential images which are binarized is de-noised. Whether each of the differential images has an edge crack is detected according to pattern of each of the differential images which are de-noised.