公开(公告)号：US11644427B2

公开(公告)日：2023-05-09

申请号：US17100982

申请日：2020-11-23

申请人： UNITED MICROELECTRONICS CORP.

发明人： Chia-Feng Hsiao ,  Chung-Hsuan Wu ,  Shuo-Yu Chen ,  Nai-Ying Lo ,  Yi-Hui Tseng ,  Chen-Hui Huang ,  Yung-Yu Yang ,  Tzu-Ping Kao

IPC分类号： G06K9/00 ,  G01N21/95 ,  H01L21/66 ,  G01N21/956 ,  G06T7/00 ,  G06T7/13 ,  G06V10/30 ,  G06V10/28 ,  G06V10/26 ,  G01N21/88 ,  G06T5/50 ,  G06V10/22

CPC分类号： G01N21/9503 ,  G01N21/8851 ,  G01N21/95607 ,  G06T5/50 ,  G06T7/001 ,  G06T7/0004 ,  G06T7/13 ,  G06V10/22 ,  G06V10/26 ,  G06V10/28 ,  G06V10/30 ,  H01L22/24 ,  G06T2207/20212 ,  G06T2207/20221 ,  G06T2207/30148

摘要： An automatic detection method and an automatic detection system for detecting any crack on wafer edges are provided. The automatic detection method includes the following steps. Several wafer images of several wafers are obtained. The wafer images are integrated to create a templet image. Each of the wafer images is compared with the templet image to obtain a differential image. Each of the differential images is binarized. Each of the differential images which are binarized is de-noised. Whether each of the differential images has an edge crack is detected according to pattern of each of the differential images which are de-noised.

公开(公告)号：US20160274570A1

公开(公告)日：2016-09-22

申请号：US14660961

申请日：2015-03-18

申请人： UNITED MICROELECTRONICS CORP.

发明人： Lian-Hua Shih ,  Ching-Hsing Hsieh ,  Feng-Chi Chung ,  Chia-Chi Chang ,  Yu-Cheng Lin ,  Sian-Jhu Tsai ,  Meng-Chih Chang ,  Yi-Hui Tseng

IPC分类号： G05B19/4097 ,  G05B15/02

CPC分类号： G05B19/41875 ,  G05B2219/32194 ,  G05B2219/37224 ,  Y02P90/22

摘要： A method of virtual metrology is disclosed. Process data and measurement values corresponding to a workpiece are collected. The process data and the measurement values are used to establish a conjecture model. A theoretical model corresponding to the workpiece and the conjecture model is used to establish another conjecture model. The another conjecture model is used to establish a virtual metrology value. The virtual metrology value is used to predict properties of a subsequently manufactured workpiece.

摘要翻译： 公开了一种虚拟测量方法。 收集与工件对应的工艺数据和测量值。 过程数据和测量值用于建立猜想模型。 使用对应于工件和推测模型的理论模型来建立另一个推测模型。 另一个猜想模型用于建立虚拟计量学值。 虚拟计量值用于预测随后制造的工件的性能。