- Patent Title: Flexible piezoelectric acoustic sensor fabricated integrally with Si as the supporting substrate, voice sensor using thin film polymer and voice sensor with different thickness and voice sensing method using same
-
Application No.: US17347415Application Date: 2021-06-14
-
Publication No.: US11647338B2Publication Date: 2023-05-09
- Inventor: Keonjae Lee , Young Hoon Jung , Jae Hyun Han , Hee Seung Wang , Mingi Chung
- Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY , FRONICS INC.
- Applicant Address: KR Daejeon
- Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY,FRONICS INC.
- Current Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY,FRONICS INC.
- Current Assignee Address: KR Daejeon; KR Daejeon
- Priority: KR 20200080524 2020.06.30 KR 20200080533 2020.06.30 KR 20200080551 2020.06.30
- Main IPC: H04R17/02
- IPC: H04R17/02 ; H10N30/88 ; H10N30/20 ; H10N30/853 ; H10N30/078 ; H04R3/04 ; H04R1/04 ; H04R17/00 ; H04R7/04 ; H03F3/183 ; H01L41/053 ; H01L41/09 ; H01L41/187 ; H01L41/318
Abstract:
Provided is a voice sensor comprising a piezoelectric material layer includes a substrate, a support layer, a metal layer, a piezoelectric material layer on the metal layer and an electrode on the piezoelectric material layer, and the substrate integrally supports a device layer of the voice sensor by exposing a part of a thin film including the piezoelectric material layer, the electrode and a polymer layer.
Public/Granted literature
Information query
