Invention Grant
- Patent Title: Systems and methods for processing transparent materials using adjustable laser beam focal lines
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Application No.: US15325905Application Date: 2015-07-14
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Publication No.: US11648623B2Publication Date: 2023-05-16
- Inventor: Jacques Gollier , Garrett Andrew Piech
- Applicant: Corning Incorporated
- Applicant Address: US NY Corning
- Assignee: CORNING INCORPORATED
- Current Assignee: CORNING INCORPORATED
- Current Assignee Address: US NY Corning
- Agent Svetlana Z. Short; Robert L. Carlson
- International Application: PCT/US2015/040259 2015.07.14
- International Announcement: WO2016/010954A 2016.01.21
- Date entered country: 2017-01-12
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K26/067 ; B23K26/073 ; C03B33/02 ; G02B5/00 ; G02B27/09 ; B23K26/06 ; G02B7/10 ; B23K103/00 ; G02B7/14

Abstract:
A system for and a method of processing a transparent material, such as glass, using an adjustable laser beam line focus are disclosed. The system for processing a transparent material includes a laser source operable to emit a pulsed laser beam, and an optical assembly (6′) disposed within an optical path of the pulsed laser beam. The optical assembly (6′) is configured to transform the pulsed laser beam into a laser beam focal line having an adjustable length and an adjustable diameter. At least a portion of the laser beam focal line is operable to be positioned within a bulk of the transparent material such that the laser beam focal line produces a material modification along the laser beam focal line. Method of laser processing a transparent material by adjusting at least one of the length of the laser beam focal line and the diameter of the laser beam focal line is also disclosed.
Public/Granted literature
- US20170189991A1 SYSTEMS AND METHODS FOR PROCESSING TRANSPARENT MATERIALS USING ADJUSTABLE LASER BEAM FOCAL LINES Public/Granted day:2017-07-06
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