Invention Grant
- Patent Title: Method for cleaning substrate and cleaning device
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Application No.: US16904058Application Date: 2020-06-17
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Publication No.: US11651953B2Publication Date: 2023-05-16
- Inventor: Minako Inukai , Hideaki Sakurai , Kyo Otsubo , Tetsuo Takemoto
- Applicant: KIOXIA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kim & Stewart LLP
- Priority: JP 16156815 2016.08.09
- The original application number of the division: US15448549 2017.03.02
- Main IPC: H01L21/02
- IPC: H01L21/02 ; B08B3/04 ; B08B7/00 ; B08B3/08 ; B08B3/12 ; H01L21/67 ; H01L21/66
Abstract:
According to one embodiment, a method including supplying a liquid onto a substrate, solidifying the liquid on the substrate to form a solidified body, and melting the solidified body of the liquid on the substrate is provided. When solidifying the liquid, an internal pressure of the liquid on the substrate is varied.
Public/Granted literature
- US20200321212A1 METHOD FOR CLEANING SUBSTRATE AND CLEANING DEVICE Public/Granted day:2020-10-08
Information query
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