公开(公告)号：US11651953B2

公开(公告)日：2023-05-16

申请号：US16904058

申请日：2020-06-17

Applicant: KIOXIA CORPORATION

Inventor： Minako Inukai ,  Hideaki Sakurai ,  Kyo Otsubo ,  Tetsuo Takemoto

IPC: H01L21/02 ,  B08B3/04 ,  B08B7/00 ,  B08B3/08 ,  B08B3/12 ,  H01L21/67 ,  H01L21/66

CPC classification number: H01L21/02101 ,  B08B3/041 ,  B08B3/08 ,  B08B3/123 ,  B08B7/0014 ,  H01L21/67051 ,  H01L21/67248 ,  H01L22/12 ,  H01L21/02082

Abstract: According to one embodiment, a method including supplying a liquid onto a substrate, solidifying the liquid on the substrate to form a solidified body, and melting the solidified body of the liquid on the substrate is provided. When solidifying the liquid, an internal pressure of the liquid on the substrate is varied.