Invention Grant
- Patent Title: Shrinkable package assembly
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Application No.: US16219168Application Date: 2018-12-13
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Publication No.: US11652031B2Publication Date: 2023-05-16
- Inventor: Florence Pon , Yi Xu , Min-Tih Lai
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/373 ; H01L23/498 ; H01L23/00
Abstract:
A semiconductor structure is disclosed. The semiconductor structure includes a substrate an elastomer coupled to the substrate and a plurality of bondfingers on the elastomer. The substrate, the elastomer and the bondfingers are configured to cooperatively expand and retract.
Information query
IPC分类:
