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    Fiber reinforced stiffener
    1.
    发明授权
    Fiber reinforced stiffener 有权

    公开(公告)号：US11495547B2

    公开(公告)日：2022-11-08

    申请号：US16160222

    申请日：2018-10-15

    Applicant: Intel Corporation

    Inventor： Florence Pon ,  Tyler Leuten ,  Maria Angela Damille Ramiso

    IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L21/683

    Abstract: Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, the electronic package comprises a package substrate, where the package substrate comprises a plurality of buildup layers, and where each buildup layer has fiber reinforcement. In an embodiment, the electronic package further comprises a reinforcement layer, where the reinforcement layer comprises a buildup layer and fiber reinforcement, and where an orientation of the fibers in the reinforcement layer is different than an orientation of the fibers in the package substrate.

    Semiconductor package with thermal fins
    2.
    发明授权
    Semiconductor package with thermal fins 有权

    公开(公告)号：US10573575B2

    公开(公告)日：2020-02-25

    申请号：US15688662

    申请日：2017-08-28

    Applicant: Intel Corporation

    Inventor： Hyoung Il Kim ,  Florence Pon ,  Yi Xu ,  Yuhong Cai ,  Min-Tih Lai ,  Leo Craft

    IPC: H01L23/34 ,  H01L23/367 ,  H01L23/055 ,  H01L23/14 ,  H01L25/065

    Abstract: Embodiments of the present disclosure provide techniques and configurations for a semiconductor package with thermal fins, in accordance with some embodiments. In embodiments, a package assembly includes a die and a mold compound disposed on the die, to encapsulate the die. The package may further include a thermal solution including one or more thermal fins attached to the mold compound at their respective ends. The thermal fins may be disposed substantially flat on a top surface of the mold compound at a first temperature, and rise away from the top surface of the mold compound in response to a change of temperature to a second temperature, to reach an enclosure that surrounds the package assembly, to provide direct heat conductivity between the die and the enclosure. The second temperature may be greater than the first temperature. Other embodiments may be described and/or claimed.

    SEMICONDUCTOR PACKAGE WITH THERMAL FINS
    5.
    发明申请
    SEMICONDUCTOR PACKAGE WITH THERMAL FINS 审中-公开

    公开(公告)号：US20190067156A1

    公开(公告)日：2019-02-28

    申请号：US15688662

    申请日：2017-08-28

    Applicant: Intel Corporation

    Inventor： Hyoung Il Kim ,  Florence Pon ,  Yi Xu ,  Yuhong Cai ,  Min-Tih Lai ,  Leo Craft

    IPC: H01L23/367 ,  H01L23/34 ,  H01L23/055 ,  H01L23/14 ,  H01L25/065

    Abstract: Embodiments of the present disclosure provide techniques and configurations for a semiconductor package with thermal fins, in accordance with some embodiments. In embodiments, a package assembly may comprise a die and a mold compound disposed on the die, to encapsulate the die. The package may further include a thermal solution comprising one or more thermal fins attached to the mold compound at their respective ends. The thermal fins may be disposed substantially flat on a top surface of the mold compound at a first temperature, and rise away from the top surface of the mold compound in response to a change of temperature to a second temperature, to reach an enclosure that surrounds the package assembly, to provide direct heat conductivity between the die and the enclosure. The second temperature may be greater than the first temperature. Other embodiments may be described and/or claimed.

    BLOCKCHAIN-BASED DIGITAL DATA EXCHANGE
    6.
    发明申请
    BLOCKCHAIN-BASED DIGITAL DATA EXCHANGE 审中-公开

    公开(公告)号：US20190050854A1

    公开(公告)日：2019-02-14

    申请号：US16147012

    申请日：2018-09-28

    Applicant: Intel Corporation

    Inventor： Xue Yang ,  Florence Pon ,  Naissa Conde ,  Wei Yee Koay ,  Maruti Gupta Hyde

    IPC: G06Q20/38 ,  G06F17/30 ,  H04L9/08

    Abstract: Example blockchain-based digital data exchanges including example data publisher endpoint devices and example data subscriber endpoint systems are disclosed herein. Example data publisher endpoint devices disclosed herein include a datamart publisher client to transmit a message to a data exchange to publish availability of data to be accessed from data storage associated with the data publisher endpoint device, and in response to a request from a data subscriber endpoint system, initiate a transaction to provide the data subscriber endpoint system with access to the data. Disclosed example data publisher endpoint devices also include a blockchain client to publish a record of the transaction to a blockchain network when the transaction is validated by the datamart publisher client, the record to be included in a blockchain implemented by the blockchain network.

    Diode for use in testing semiconductor packages
    9.
    发明授权
    Diode for use in testing semiconductor packages 有权

    公开(公告)号：US11545464B2

    公开(公告)日：2023-01-03

    申请号：US16235859

    申请日：2018-12-28

    Applicant: Intel Corporation

    Inventor： Yi Xu ,  Hyoung Il Kim ,  Florence Pon

    IPC: H01L23/48 ,  H01L25/18 ,  H01L25/00 ,  H01L23/00 ,  H01L25/065 ,  H01L21/66

    Abstract: Embodiments described herein provide techniques for testing a semiconductor package by using a diode to couple a test pad to a contact pad. In one scenario, a package comprises a die stack comprising one or more dies and a molding compound encapsulating the die stack. In this package, a substrate is over the molding compound. Also, a test pad and a contact pad are on a surface of the substrate. The contact pad is coupled to the die stack. A diode couples the test pad to the contact pad. In one example, the test pad is coupled to a P side of the diode's P-N junction and the contact pad is coupled to an N side of the diode's P-N junction. In operation, current can flow from the test pad through the contact pad (and the die stack), but current cannot flow from the contact pad through the test pad.

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