Invention Grant
- Patent Title: High temperature flow splitting component and heat exchanger and reforming means using the same
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Application No.: US16697305Application Date: 2019-11-27
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Publication No.: US11656032B2Publication Date: 2023-05-23
- Inventor: Cheng-Hao Yang , Shing-Cheng Chang , Yen-Hsin Chan , Chia-Hsin Lee , Wen-Sheng Chang
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsin-Chu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsin-Chu
- Agency: Locke Lord LLP
- Agent Tim Tingkang Xia, Esq.
- Priority: TW 8143022 2019.11.26
- Main IPC: F28D9/00
- IPC: F28D9/00 ; F28D7/16 ; F28F3/04 ; F28F13/06 ; F28F9/02 ; F28D1/053

Abstract:
A high-temperature flow-splitting component, applicable to a temperature range from a first temperature to a second temperature, includes an entrance channel, at least one primary channel and at least one subordinate channel. The entrance channel is used for introducing a fluid at a total flow rate. The at least one primary channel for introducing the fluid from the entrance channel at a first flow rate is connected with the entrance channel by a first angle ranging from 90°˜270°. The at least one subordinate channel for introducing the fluid from the entrance channel at a second flow rate is connected with the at least one primary channel by a second angle ranging from 30°˜150°. A sum of the first flow rate and the second flow rate is equal to the total flow rate.
Public/Granted literature
- US20210095927A1 HIGH TEMPERATURE FLOW SPLITTING COMPONENT AND HEAT EXCHANGER AND REFORMING MEANS USING THE SAME Public/Granted day:2021-04-01
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