- Patent Title: Semiconductor device package and method of manufacturing the same
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Application No.: US16749635Application Date: 2020-01-22
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Publication No.: US11658102B2Publication Date: 2023-05-23
- Inventor: Yuanhao Yu , Cheng Yuan Chen , Chun Chen Chen , Jiming Li , Chien-Wen Tu
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48 ; H01L23/66
Abstract:
A semiconductor device package includes a carrier, an electronic component and a connector. The electronic component is disposed on the carrier. The connector is disposed on the carrier and electrically connected to the electronic component. A S11 parameter of the connector is less than −20 dB.
Public/Granted literature
- US20210225747A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-07-22
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