专利检索 ap:("Advanced Semiconductor Engineering, Inc.") AND inv:"Chien-Wen Tu" 第 1 页

1.

发明授权
Semiconductor device package and method of manufacturing the same 有权

公开(公告)号：US11658102B2

公开(公告)日：2023-05-23

申请号：US16749635

申请日：2020-01-22

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Yuanhao Yu , Cheng Yuan Chen , Chun Chen Chen , Jiming Li , Chien-Wen Tu

IPC分类号： H01L23/498 , H01L21/48 , H01L23/66

CPC分类号： H01L23/49811 , H01L21/4889 , H01L23/66 , H01L2223/6605

摘要： A semiconductor device package includes a carrier, an electronic component and a connector. The electronic component is disposed on the carrier. The connector is disposed on the carrier and electrically connected to the electronic component. A S11 parameter of the connector is less than −20 dB.