公开(公告)号：US11133245B2

公开(公告)日：2021-09-28

申请号：US16664631

申请日：2019-10-25

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Chi-Tsung Chiu ,  Hui-Ying Hsieh ,  Kuo-Hua Chen ,  Cheng Yuan Chen

IPC分类号： H01L23/48 ,  H01L23/498 ,  H01L21/768 ,  H01L23/495

摘要： A semiconductor package structure includes a base, at least one semiconductor element, a first dielectric layer, a second dielectric layer and a circuit layer. The semiconductor element is disposed on the base and has an upper surface. The first dielectric layer covers at least a portion of a peripheral surface of the semiconductor element and has a top surface. The top surface is non-coplanar with the upper surface of the semiconductor element. The second dielectric layer covers the semiconductor element and the first dielectric layer. The circuit layer extends through the second dielectric layer to electrically connect the semiconductor element.

公开(公告)号：US11658102B2

公开(公告)日：2023-05-23

申请号：US16749635

申请日：2020-01-22

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Yuanhao Yu ,  Cheng Yuan Chen ,  Chun Chen Chen ,  Jiming Li ,  Chien-Wen Tu

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L23/66

CPC分类号： H01L23/49811 ,  H01L21/4889 ,  H01L23/66 ,  H01L2223/6605

摘要： A semiconductor device package includes a carrier, an electronic component and a connector. The electronic component is disposed on the carrier. The connector is disposed on the carrier and electrically connected to the electronic component. A S11 parameter of the connector is less than −20 dB.

公开(公告)号：US11552026B2

公开(公告)日：2023-01-10

申请号：US16264599

申请日：2019-01-31

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Cheng Yuan Chen ,  Jiming Li ,  Chun Chen Chen ,  Yuanhao Yu

IPC分类号： H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01L23/00 ,  H01L21/56 ,  H01Q1/22 ,  H01Q1/52 ,  H01L21/48

摘要： A semiconductor package includes a substrate, a preformed feeding element, a preformed shielding element, and an encapsulant. The preformed feeding element is disposed on the substrate and the preformed feeding element is disposed on the substrate and adjacent to the preformed feeding element. The encapsulant encapsulates the preformed feeding element and the preformed shielding element.

公开(公告)号：US11764137B2

公开(公告)日：2023-09-19

申请号：US17140926

申请日：2021-01-04

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Cheng-Lin Ho ,  Chih-Cheng Lee ,  Chun Chen Chen ,  Cheng Yuan Chen

IPC分类号： H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H05K1/18 ,  H05K3/34 ,  H01L21/48

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49838 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/10446 ,  H05K2201/10522

摘要： A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.

公开(公告)号：US11127707B2

公开(公告)日：2021-09-21

申请号：US16512132

申请日：2019-07-15

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Chi-Tsung Chiu ,  Hui-Ying Hsieh ,  Hui Hua Lee ,  Cheng Yuan Chen

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/13 ,  H01L21/56

摘要： A semiconductor package structure includes a base material, at least one semiconductor chip, an encapsulant, a depression structure, a redistribution layer and at least one conductive via. The semiconductor chip is disposed on the base material. The encapsulant is disposed on the base material and covers the at least one semiconductor chip. The encapsulant has an outer side surface. The depression structure is disposed adjacent to and exposed from of the outer side surface the encapsulant. The redistribution layer is disposed on the encapsulant. The conductive via is disposed in the encapsulant and electrically connects the semiconductor chip and the redistribution layer.