Invention Grant
- Patent Title: Method of manufacturing light emitting diodes and light emitting diode
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Application No.: US17645656Application Date: 2021-12-22
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Publication No.: US11658265B2Publication Date: 2023-05-23
- Inventor: Bastian Galler , Jürgen Off
- Applicant: OSRAM OLED GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM OLED GmbH
- Current Assignee: OSRAM OLED GmbH
- Current Assignee Address: DE Regensburg
- Agency: Slater Matsil, LLP
- Priority: DE 2017105397.2 2017.03.14
- The original application number of the division: US16493499
- Main IPC: H01L33/10
- IPC: H01L33/10 ; H01L33/00 ; H01L33/02 ; H01L33/06 ; H01L33/22 ; H01L33/32 ; H01L33/42 ; G01N21/33

Abstract:
In an embodiment a light emitting diode includes an n-type n-layer, a p-type p-layer and an intermediate active zone configured to generate ultraviolet radiation, a p-type semiconductor contact layer having a varying thickness and a plurality of thickness maxima directly located on the p-layer and an ohmic-conductive electrode layer directly located on the semiconductor contact layer, wherein the n-layer and the active zone are each of AlGaN and the p-layer is of AlGaN or InGaN, wherein the semiconductor contact layer is a highly doped GaN layer, and wherein the thickness maxima have an area concentration of at least 104 cm−2.
Public/Granted literature
- US20220115559A1 Method of Manufacturing Light Emitting Diodes and Light Emitting Diode Public/Granted day:2022-04-14
Information query
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