Invention Grant
- Patent Title: Device, package and/or substrate comprising curved antenna
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Application No.: US17002594Application Date: 2020-08-25
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Publication No.: US11658403B2Publication Date: 2023-05-23
- Inventor: Changhan Hobie Yun , Daniel Daeik Kim , Paragkumar Ajaybhai Thadesar , Nosun Park , Sameer Sunil Vadhavkar
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: US CA San Diego
- Agent Michelle Gallardo
- Main IPC: H01Q9/04
- IPC: H01Q9/04 ; H01Q1/38 ; H01Q13/02 ; H01Q21/28 ; H04B3/52 ; H04B3/56

Abstract:
A substrate that includes at least one dielectric layer, a plurality of interconnects, and a curved antenna coupled to a surface of the substrate. The curved antenna is curved relative to the surface of the substrate such that at least part of the curved antenna is offset from the surface of the substrate. The substrate includes a first antenna dielectric layer coupled to the surface of the substrate, an antenna ground interconnect coupled to the first antenna dielectric layer, and a second antenna dielectric layer coupled to the antenna ground interconnect. The antenna ground interconnect configured to be coupled to ground. The curved antenna is coupled to the second antenna dielectric layer.
Public/Granted literature
- US20220069453A1 DEVICE, PACKAGE AND/OR SUBSTRATE COMPRISING CURVED ANTENNA Public/Granted day:2022-03-03
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